개요
Silicone encapsulants are RTV silicone materials used to protect electronic components, connection points, LEDs, sensors, modules and electrical assemblies. After curing, they form a flexible protective layer that can help provide electrical insulation, moisture resistance, dust protection, stress relief and environmental sealing.
애플리케이션마다 다른 재료 특성이 필요합니다. 쿠션과 손쉬운 유지보수를 위해 부드럽고 재진입이 가능한 실리콘 젤이 더 적합한 경우도 있고, 보다 안정적인 캡슐화와 광범위한 부품 보호를 위해 실리콘 포팅 컴파운드가 필요한 경우도 있습니다.
| Project Requirement | 실리콘 젤 | 실리콘 포팅 컴파운드 |
|---|---|---|
| Very soft cured material | Recommended | Depending on grade |
| Minimum stress on sensitive components | Excellent starting direction | Good with softer grades |
| Easier future re-entry | Recommended | 더 제한적 |
| PCB and module encapsulation | Application-dependent | Recommended starting direction |
| Greater cured mechanical support | 제한적 | Better choice |
| Cable joints and connectors | Common direction | Application-dependent |
| Moisture/environmental protection | 예 | 예 |
| Automatic dispensing | Grade-dependent | Grade-dependent |

For LED modules and light components that require flexible protection, sealing, and optical or environmental stability.

For circuit boards that need insulation, moisture protection, vibration resistance, and more stable environmental sealing.

절연, 밀봉 및 안정적인 환경 보호가 필요한 케이블 액세서리 시스템에 적합합니다.

습기 침투, 오염 및 기계적 스트레스로부터 커넥터를 보호합니다.

Soft silicone encapsulation can help protect sensitive sensors while minimizing mechanical stress around components.

민감한 전기 및 전자 어셈블리의 캡슐화 및 보호에 적합합니다.
Compare our two-part, platinum-cure silicone potting compounds for electronic insulation and encapsulation. Select a grade based on your requirements for hardness, viscosity, appearance, and mechanical protection.
| Technical Property | TE-8810 Low-Hardness Silicone | TE-8830 General-Purpose Silicone |
|---|---|---|
| 모양 | Transparent to translucent | Gray or white |
| 치료 시스템 | Platinum / Addition Cure | Platinum / Addition Cure |
| Mixing Ratio (A:B) | 1:1 by weight | 1:1 by weight |
| Mixed Viscosity at 25°C | 800 ± 500 mPa·s | 2,000 ± 500 mPa·s |
| Working Time at 25°C | 60–120 min | 60–120 min |
| Full Cure at 25°C | 6–12 hours | 6–12 hours |
| Cured Hardness | Shore A 10 ± 2 | Shore A 30 ± 2 |
| 일반적인 애플리케이션 | Low-stress PCB protection, sensors and delicate electronics | General PCB potting, control modules and industrial electronics |
Discuss custom formulation options with Topsil’s technical team.
| Selection Factor | 중요한 이유 |
|---|---|
| 점성 | Determines how easily the silicone flows through component gaps and cavities |
| Cured Hardness | Affects component stress, flexibility and mechanical support |
| 근무 시간 | Must match manual or automatic dispensing speed |
| 치료 시간 | Influences production throughput and handling |
| 믹스 비율 | Important for dispensing equipment and process control |
| Operating Temperature | Should match continuous and peak service conditions |
| Electrical Requirements | Grade-specific dielectric properties should meet project requirements |
| Thermal Requirements | Heat-generating assemblies may require additional thermal-performance evaluation |
| Color / Transparency | May matter for inspection, optical or appearance requirements |
| Evaluation Item | 확인 사항 |
|---|---|
| A/B mixing | Ratio and mixing consistency |
| Flow behavior | Filling around components and cavities |
| 근무 시간 | Practical dispensing window |
| 치료 | Cure condition and surface state |
| Cured material | Hardness and flexibility |
| Process | Manual or automatic dispensing suitability |
| 애플리케이션 | Performance in actual assembly geometry |
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Topsil Silicone의 매니저인 에반입니다. 전문 공급업체를 찾으신 것을 축하드립니다! 문의 사항을 보내주시면 24시간 이내에 연락드리겠습니다.