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VISIÓN GENERAL
Silicone encapsulants are RTV silicone materials used to protect electronic components, connection points, LEDs, sensors, modules and electrical assemblies. After curing, they form a flexible protective layer that can help provide electrical insulation, moisture resistance, dust protection, stress relief and environmental sealing.
Las distintas aplicaciones requieren diferentes propiedades de los materiales. Algunas se adaptan mejor al gel de silicona blando y reentrable para amortiguar y facilitar el mantenimiento, mientras que otras requieren compuestos de encapsulado de silicona para un encapsulado más estable y una protección más amplia de los componentes.
| Project Requirement | Gel de silicona | Encapsulado de silicona |
|---|---|---|
| Very soft cured material | Recommended | Depending on grade |
| Minimum stress on sensitive components | Excellent starting direction | Good with softer grades |
| Easier future re-entry | Recommended | Más limitado |
| PCB and module encapsulation | Application-dependent | Recommended starting direction |
| Greater cured mechanical support | Limitado | Better choice |
| Cable joints and connectors | Common direction | Application-dependent |
| Moisture/environmental protection | Sí | Sí |
| Automatic dispensing | Grade-dependent | Grade-dependent |
For LED modules and light components that require flexible protection, sealing, and optical or environmental stability.
For circuit boards that need insulation, moisture protection, vibration resistance, and more stable environmental sealing.
Para sistemas de accesorios de cables que requieren aislamiento, sellado y una protección medioambiental fiable.
Para proteger los conectores contra la entrada de humedad, la contaminación y los esfuerzos mecánicos.
Soft silicone encapsulation can help protect sensitive sensors while minimizing mechanical stress around components.
Para el encapsulado y la protección de conjuntos eléctricos y electrónicos sensibles.
Compare our two-part, platinum-cure silicone potting compounds for electronic insulation and encapsulation. Select a grade based on your requirements for hardness, viscosity, appearance, and mechanical protection.
| Technical Property | TE-8810 Low-Hardness Silicone | TE-8830 General-Purpose Silicone |
|---|---|---|
| Apariencia | Transparent to translucent | Gray or white |
| Sistema de curado | Platinum / Addition Cure | Platinum / Addition Cure |
| Mixing Ratio (A:B) | 1:1 by weight | 1:1 by weight |
| Mixed Viscosity at 25°C | 800 ± 500 mPa·s | 2,000 ± 500 mPa·s |
| Working Time at 25°C | 60–120 min | 60–120 min |
| Full Cure at 25°C | 6–12 hours | 6–12 hours |
| Cured Hardness | Shore A 10 ± 2 | Shore A 30 ± 2 |
| Aplicaciones típicas | Low-stress PCB protection, sensors and delicate electronics | General PCB potting, control modules and industrial electronics |
Discuss custom formulation options with Topsil’s technical team.
| Selection Factor | Por qué es importante |
|---|---|
| Viscosidad | Determines how easily the silicone flows through component gaps and cavities |
| Cured Hardness | Affects component stress, flexibility and mechanical support |
| Tiempo de trabajo | Must match manual or automatic dispensing speed |
| Tiempo de curado | Influences production throughput and handling |
| Proporción de mezcla | Important for dispensing equipment and process control |
| Operating Temperature | Should match continuous and peak service conditions |
| Electrical Requirements | Grade-specific dielectric properties should meet project requirements |
| Thermal Requirements | Heat-generating assemblies may require additional thermal-performance evaluation |
| Color / Transparency | May matter for inspection, optical or appearance requirements |
| Evaluation Item | Qué comprobamos |
|---|---|
| A/B mixing | Ratio and mixing consistency |
| Flow behavior | Filling around components and cavities |
| Tiempo de trabajo | Practical dispensing window |
| Cura | Cure condition and surface state |
| Cured material | Hardness and flexibility |
| Process | Manual or automatic dispensing suitability |
| Aplicación | Performance in actual assembly geometry |
Sus datos serán estrictamente confidenciales.
Este es Evan, el Gerente de Topsil Silicone. Le felicitamos por haber encontrado un proveedor profesional. Pls enviar su consulta, y nos pondremos en contacto con usted dentro de 24 horas.
