نظرة عامة
Silicone encapsulants are RTV silicone materials used to protect electronic components, connection points, LEDs, sensors, modules and electrical assemblies. After curing, they form a flexible protective layer that can help provide electrical insulation, moisture resistance, dust protection, stress relief and environmental sealing.
تحتاج التطبيقات المختلفة إلى خصائص مواد مختلفة. فبعضها يناسبه بشكل أفضل هلام السيليكون الناعم القابل لإعادة الإدخال من أجل التوسيد والصيانة الأسهل، بينما يحتاج البعض الآخر إلى مركبات تغليف السيليكون من أجل تغليف أكثر ثباتًا وحماية أوسع للمكونات.
| Project Requirement | جل السيليكون | مركب التخزين السيليكوني |
|---|---|---|
| Very soft cured material | Recommended | Depending on grade |
| Minimum stress on sensitive components | Excellent starting direction | Good with softer grades |
| Easier future re-entry | Recommended | أكثر محدودية |
| PCB and module encapsulation | Application-dependent | Recommended starting direction |
| Greater cured mechanical support | محدودة | Better choice |
| Cable joints and connectors | Common direction | Application-dependent |
| Moisture/environmental protection | نعم | نعم |
| Automatic dispensing | Grade-dependent | Grade-dependent |

For LED modules and light components that require flexible protection, sealing, and optical or environmental stability.

For circuit boards that need insulation, moisture protection, vibration resistance, and more stable environmental sealing.

بالنسبة لأنظمة ملحقات الكابلات التي تتطلب العزل والإغلاق والحماية البيئية الموثوقة.

لحماية الموصل من دخول الرطوبة والتلوث والإجهاد الميكانيكي.

Soft silicone encapsulation can help protect sensitive sensors while minimizing mechanical stress around components.

لتغليف وحماية التجميعات الكهربائية والإلكترونية الحساسة.
Compare our two-part, platinum-cure silicone potting compounds for electronic insulation and encapsulation. Select a grade based on your requirements for hardness, viscosity, appearance, and mechanical protection.
| Technical Property | TE-8810 Low-Hardness Silicone | TE-8830 General-Purpose Silicone |
|---|---|---|
| المظهر | Transparent to translucent | Gray or white |
| نظام العلاج | Platinum / Addition Cure | Platinum / Addition Cure |
| Mixing Ratio (A:B) | 1:1 by weight | 1:1 by weight |
| Mixed Viscosity at 25°C | 800 ± 500 mPa·s | 2,000 ± 500 mPa·s |
| Working Time at 25°C | 60–120 min | 60–120 min |
| Full Cure at 25°C | 6–12 hours | 6–12 hours |
| Cured Hardness | Shore A 10 ± 2 | Shore A 30 ± 2 |
| التطبيقات النموذجية | Low-stress PCB protection, sensors and delicate electronics | General PCB potting, control modules and industrial electronics |
Discuss custom formulation options with Topsil’s technical team.
| Selection Factor | ما أهمية ذلك |
|---|---|
| اللزوجة | Determines how easily the silicone flows through component gaps and cavities |
| Cured Hardness | Affects component stress, flexibility and mechanical support |
| وقت العمل | Must match manual or automatic dispensing speed |
| وقت العلاج | Influences production throughput and handling |
| نسبة المزيج | Important for dispensing equipment and process control |
| Operating Temperature | Should match continuous and peak service conditions |
| Electrical Requirements | Grade-specific dielectric properties should meet project requirements |
| Thermal Requirements | Heat-generating assemblies may require additional thermal-performance evaluation |
| Color / Transparency | May matter for inspection, optical or appearance requirements |
| Evaluation Item | What We Check |
|---|---|
| A/B mixing | Ratio and mixing consistency |
| Flow behavior | Filling around components and cavities |
| وقت العمل | Practical dispensing window |
| الشفاء | Cure condition and surface state |
| Cured material | Hardness and flexibility |
| Process | Manual or automatic dispensing suitability |
| التطبيق | Performance in actual assembly geometry |
سيتم الحفاظ على سرية معلوماتك بشكل صارم.
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